Largonet Ltd. has production line for PCB assembly, consisting of semi-automatic stencil printer, automatic Pick & Place machine, conveyor-loaded reflow oven, conveyor-loaded wave soldering machine, as well as various additional equipment such as small IR reflow oven, pneumatic T/P dispenser, soldering and rework stations etc.
All operations are carried out in dust-free, ESD-protected environment.
Stencil printer, model SR2700
Technical data:
- two independent motorized self-levelling squeeges with pneumatic pressure control
- motorized stencil snap-off
- maximal printing area: 480 х 420mm
- maximal stencil size: 675 x 585mm
- double-sided printing
- accepts framed and non-framed stencils
- minimal board thickness: 0.9mm
- maximal board thickness: 8mm
- camera assisted stencil centering (2 cameras)
- magnetic and vacuum panel fixation systems
Pick & Place machine TWS, model QUADRA Evo
Technical data:
- works with packages TSOP, TNT, PLCC, QFP, BGA2025 (45x45mm), BGA, LCC, etc.
placement work space: 440 x 360mm, expandable to 550 x 420mm- minimal component package size: 0201
- maximal component package size: 50 x 50mm
- typical performance: 3300 cp./h, maximal: 4400 cp./h
- placement accuracy:± 100μm
- two-nozzle placement head
- optical on-the-fly recognition and components centering (sniper);
- computer vision recognition of components
- magnetic fixation system for panel support during operation
- up to 120 tape (8mm) feeders
- 6 pneumatic stick feeders
- double-sided assembly
- automatic T/P dispenser for solder paste or glue
- works with components in trays, pallets, tape rolls and sticks
Reflow oven TWS, model QV1385
Technical data:
- heating tunnel of length 2m with combined chain&mesh conveyor
- 4 horizontal heating zones with individual digital (PID) temperature control, and 1 cooling zone
- maximal panel/board width: 400mm
- embedded standard thermal profiles for Lead and Lead-free soldering
- support of user-defined thermal profiles
- user-controlled conveyor speed
- soldering in nitrogen atmosphere*
Wave soldering machine IEMME, model ARIES 300 C
Technical data:
- acceptable panel size: between 50 х 50mm and 300 х 400mm
- variable inclination angle
- automatic flux application before soldering
- IR zone for pre-heating with regulated temperature
- Titanium pot
- digital (PID) control of pot and pre-heater temperatures
- can work with Lead and Lead-free alloys
- manual and automatic control
- variable conveyor speed: 0-200mm/min
- regulated wave height
- soldering in nitrogen atmosphere*
Additional equipment:
- professional soldering stations
- hot-air rework stations
- IR reflow oven with various thermal profiles for SMD components soldering
- semi-automatic pneumatic dispenser for solder paste and glue
- cable processing unit
- cable crimping machine*
- cable tester*
- 3D printer*
- laser cutter*
- CNC router*
Development equipment:
- Regulated desktop power supplies
- Digital dual-channel oscylloscope with spectrum-analyzer, 100МHz, 1gSa/s
- Analog dual channel oscylloscope
- Programmers for microcontrollers and memory chips
*planned