Development&Design
design of functional and schematic diagrams of digital and mixed analog-digital modules, units and systems- PCB design
- firmware development
- software (Windows) development
- face panels design
Prototyping
- building prototypes of products developed on request
- testing prototypes
- preparation of technological documentation and preparation production data for serial manufacturing of prototyped modues
Manufacturing
Printed Circuit Boards (PCB)*
- single-layer, double-layer, multi-layer (up to 8 layers)
- surface finish: HASL/ Lead-free HASL
solder mask (various colors)- silkscreen (various colors)
- laser-cut/etched stencils
Technological processes&operations
- applying soldering paste using stencil printer (stencil required)
- applying solder paste using pneumatic T/P displpenser (small series only)
- manual loading of TH components
- manual placement of SMD components (small series only)
- automatic placement of SMD components (P&P program required)
- manual soldering of TH components – Lead/Lead-free
- wave soldering of TH components (Lead only)
- IR reflow soldering of SMD components (small series only) – Lead/Lead-free
- convection reflow soldering of SMD components – Lead/Lead-free
- laser engraving and cutting*
- CNC engraving and cutting*
- silkscreen printing
- cable cutting, stripping and crimping*
- cable assemblies
Testing
- PCB electrical tests with flying probe (PCB file required)*
- module electrical/logical tests (additional information is required per product type)
- module functional tests (techncal documentation is required)
Supplies
- PCB materials
- electronic components
- technological materials
Export
- export and delivery to countries within EU
- export and delivery to countries outside EU
* part of described technological operations can be done by our trusted sub-contractors, with full warranty covered by Largonet Ltd.